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Compare Image Part # Manufacturer Description Availability Pricing Quantity RoHS Lifecycle StatusPackage / CaseSurface MountSupplier Device PackageMaterialNumber of TerminalsMaterial Type# I/Os (Max)ApprovalsBase Product NumberBrandCable TypesClock Frequency-MaxData RAM SizeDevice Logic GatesDistributed RAMEmbedded Block RAM - EBRFactory Pack QuantityFactory Pack QuantityFamily NameIhs ManufacturerJacket MaterialL1 Cache Data MemoryL1 Cache Instruction MemoryLogic CellsManufacturerManufacturer Part NumberMaximum Clock FrequencyMaximum Operating Supply VoltageMaximum Operating TemperatureMfrMinimum Operating Supply VoltageMinimum Operating TemperatureMoisture SensitiveMoisture Sensitivity LevelsMountingMounting StylesNumber of I/OsNumber of Logic Array Blocks - LABsNumber of Logic Blocks/ElementsNumber of Logic ElementsOperating Supply Voltage (Max)Operating Supply Voltage (Min)Operating Supply Voltage (Typ)Operating Temp RangeOperating Temperature (Max.)Operating Temperature (Min.)Operating Temperature ClassificationOperating Temperature-MaxPackagePackage Body MaterialPackage CodePackage DescriptionPackage Equivalence CodePackage ShapePackage StylePackage TypePart Life Cycle CodeProcess TechnologyProduct StatusProgrammableRad HardenedRangeReflow Temperature-Max (s)Risk RankRoHSRohs CodeSchedule BShipping RestrictionsSupply Voltage-MaxSupply Voltage-MinSupply Voltage-NomTypical Operating Supply VoltageUnit WeightOperating TemperaturePackagingSeriesJESD-609 CodePbfree CodeConnector TypeTypeTerminal FinishColorApplicationsAdditional FeatureHTS CodeSubcategoryTechnologyTerminal PositionTerminal FormShieldingPeak Reflow Temperature (Cel)Terminal PitchReach Compliance CodePin CountJESD-30 CodeNumber of OutputsQualification StatusOutput TypeOperating Supply VoltagePower SuppliesTemperature GradeSpeedRAM SizeCore ProcessorPeripheralsProgram Memory SizeConnectivityArchitectureNumber of InputsOrganizationSeated Height-MaxProgrammable Logic TypeAdhesiveProduct TypeSpeed GradeLegendPrimary AttributesNumber of CLBsNumber of Logic CellsNumber of CoresBackground ColorNumber of Equivalent GatesFlash SizeText ColorLanguageConnection TypeProduct CategoryStrain ReliefPower TypeDiameterLengthWidth
Compare Image Part # Manufacturer Description Availability Pricing Quantity RoHS Lifecycle StatusPackage / CaseSurface MountSupplier Device PackageMaterialNumber of TerminalsMaterial Type# I/Os (Max)ApprovalsBase Product NumberBrandCable TypesClock Frequency-MaxData RAM SizeDevice Logic GatesDistributed RAMEmbedded Block RAM - EBRFactory Pack QuantityFactory Pack QuantityFamily NameIhs ManufacturerJacket MaterialL1 Cache Data MemoryL1 Cache Instruction MemoryLogic CellsManufacturerManufacturer Part NumberMaximum Clock FrequencyMaximum Operating Supply VoltageMaximum Operating TemperatureMfrMinimum Operating Supply VoltageMinimum Operating TemperatureMoisture SensitiveMoisture Sensitivity LevelsMountingMounting StylesNumber of I/OsNumber of Logic Array Blocks - LABsNumber of Logic Blocks/ElementsNumber of Logic ElementsOperating Supply Voltage (Max)Operating Supply Voltage (Min)Operating Supply Voltage (Typ)Operating Temp RangeOperating Temperature (Max.)Operating Temperature (Min.)Operating Temperature ClassificationOperating Temperature-MaxPackagePackage Body MaterialPackage CodePackage DescriptionPackage Equivalence CodePackage ShapePackage StylePackage TypePart Life Cycle CodeProcess TechnologyProduct StatusProgrammableRad HardenedRangeReflow Temperature-Max (s)Risk RankRoHSRohs CodeSchedule BShipping RestrictionsSupply Voltage-MaxSupply Voltage-MinSupply Voltage-NomTypical Operating Supply VoltageUnit WeightOperating TemperaturePackagingSeriesJESD-609 CodePbfree CodeConnector TypeTypeTerminal FinishColorApplicationsAdditional FeatureHTS CodeSubcategoryTechnologyTerminal PositionTerminal FormShieldingPeak Reflow Temperature (Cel)Terminal PitchReach Compliance CodePin CountJESD-30 CodeNumber of OutputsQualification StatusOutput TypeOperating Supply VoltagePower SuppliesTemperature GradeSpeedRAM SizeCore ProcessorPeripheralsProgram Memory SizeConnectivityArchitectureNumber of InputsOrganizationSeated Height-MaxProgrammable Logic TypeAdhesiveProduct TypeSpeed GradeLegendPrimary AttributesNumber of CLBsNumber of Logic CellsNumber of CoresBackground ColorNumber of Equivalent GatesFlash SizeText ColorLanguageConnection TypeProduct CategoryStrain ReliefPower TypeDiameterLengthWidth
M2S150-1FCG1152I Datasheet
Mfr. Part #
M2S150-1FCG1152I
MOST Part #
536-492-M2S150-1FCG1152I
Microchip
ACLM2S150-1FCG1152I
2872 In Stock
    Min.:1
    Mult.:1
    - 1152-BBGA, FCBGA - 1152-FCBGA (35x35) - - - - - M2S150 - - - 64 kB - - - - - - - - - - - - 166 MHz - - Microchip Technology - - - - - SMD/SMT 574 - - 146124 LE - - - - - - - - Tray - - - - - - - - - Active - - - - - - - - - - - - 1.2000 V - -40 to 100 °C - SmartFusion®2 - - - - - - - - - - - - - - - - - - - - - - - - - 166MHz 64KB ARM® Cortex®-M3 DDR, PCIe, SERDES 512 kB CANbus, Ethernet, I²C, SPI, UART/USART, USB MCU, FPGA - - - - - - 1 - FPGA - 150K Logic Modules - - 1 Core - - 512KB - - - - - - - - -
    M2S150-1FCG1152I
    M2S150-1FCG1152I

    536-492-M2S150-1FCG1152I Microchip
    RoHS :
    Package : -
    In Stock : 2872
    1 : -
    M2S010TS-1VFG400T2 Datasheet
    Mfr. Part #
    M2S010TS-1VFG400T2
    MOST Part #
    536-492-M2S010TS-1VFG400T2
    Microchip
    FPGA SmartFusion2 Family 12084 Cells 65nm Technology 1.2V 400-Pin VF-BGA
    2693 In Stock
      Min.:1
      Mult.:1
      - 400-LFBGA - 400-VFBGA (17x17) - - - - - M2S010 - - - - - - - - - MICROSEMI CORP - - - - Microsemi Corporation M2S010TS-1VFG400T2 - - - Microchip Technology - - - - - - 195 - - - - - - - - - - - Tray - - , - - - - Active - Active - - - 40 5.8 - Yes - - - - - 1.2000 V - 0 to 85 °C - Automotive, AEC-Q100, SmartFusion®2 e1 Yes - - Tin/Silver/Copper (Sn/Ag/Cu) - - - - - - - - - 250 - compliant - - - - - - - - 166MHz 64KB ARM® Cortex®-M3 DDR, PCIe, SERDES - CANbus, Ethernet, I²C, SPI, UART/USART, USB MCU, FPGA - - - FIELD PROGRAMMABLE GATE ARRAY - - 1 - FPGA - 10K Logic Modules - - - - - 256KB - - - - - - - - -
      M2S010TS-1VFG400T2
      M2S010TS-1VFG400T2

      536-492-M2S010TS-1VFG400T2 Microchip
      RoHS :
      Package : -
      In Stock : 2693
      1 : -
      A2F200M3F-CSG288 Datasheet
      Mfr. Part #
      A2F200M3F-CSG288
      MOST Part #
      536-492-A2F200M3F-CSG288
      Microchip
      ACLA2F200M3F-CSG288
      34 In Stock
        Min.:1
        Mult.:1
        - 288-TFBGA, CSPBGA YES 288-CSP (11x11) - 288 - - - A2F200 - - 80 MHz - 200000 - - - - MICROSEMI CORP - - - - Microsemi Corporation A2F200M3F-CSG288 - 1.575 V - Microchip Technology 1.425 V - - 3 - - MCU - 31, FPGA - 78 - - - - - - - - - - 85 °C Tray PLASTIC/EPOXY TFBGA 11 X 11 MM, 1.05 MM HEIGHT, 0.50 MM PITCH, GREEN, BGA-288 BGA288,21X21,20 SQUARE GRID ARRAY, THIN PROFILE, FINE PITCH - Active - Active - - - NOT SPECIFIED 5.23 - Yes - - 1.575 V 1.425 V 1.5 V 1.5000 V - 0 to 85 °C - SmartFusion® e1 - - - Tin/Silver/Copper (Sn/Ag/Cu) - - - - Field Programmable Gate Arrays CMOS BOTTOM BALL - NOT SPECIFIED 0.5 mm compliant - S-PBGA-B288 78 Not Qualified - - 1.5,1.8,2.5,3.3 V OTHER 80MHz 64KB ARM® Cortex®-M3 DMA, POR, WDT - EBI/EMI, Ethernet, I²C, SPI, UART/USART MCU, FPGA 78 4608 CLBS, 200000 GATES 1.05 mm FIELD PROGRAMMABLE GATE ARRAY - - STD - ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops 4608 4608 - - 200000 256KB - - - - - - - 11 mm 11 mm
        A2F200M3F-CSG288
        A2F200M3F-CSG288

        536-492-A2F200M3F-CSG288 Microchip
        RoHS :
        Package : -
        In Stock : 34
        1 : -
        A2F200M3F-PQG208I Datasheet
        Mfr. Part #
        A2F200M3F-PQG208I
        MOST Part #
        536-492-A2F200M3F-PQG208I
        Microchip
        ACLA2F200M3F-PQG208I
        34 In Stock
          Min.:1
          Mult.:1
          - 208-BFQFP YES 208-PQFP (28x28) - 208 - - - A2F200 - - 80 MHz - 200000 - - - - MICROSEMI CORP - - - - Microsemi Corporation A2F200M3F-PQG208I - 1.575 V - Microchip Technology 1.425 V - - 3 - - MCU - 22, FPGA - 66 - - - - - - - - - - - Tray PLASTIC/EPOXY FQFP FQFP, QFP208,1.2SQ,20 QFP208,1.2SQ,20 SQUARE FLATPACK, FINE PITCH - Active - Active - - - 30 1.51 - Yes - - 1.575 V 1.425 V 1.5 V 1.5000 V - -40 to 100 °C - SmartFusion® - - - - Pure Matte Tin (Sn) - - - 8542.39.00.01 Field Programmable Gate Arrays CMOS QUAD GULL WING - 245 0.5 mm compliant - S-PQFP-G208 66 Not Qualified - - 1.5,1.8,2.5,3.3 V - 80MHz 64KB ARM® Cortex®-M3 DMA, POR, WDT - EBI/EMI, Ethernet, I²C, SPI, UART/USART MCU, FPGA 66 4608 CLBS, 200000 GATES 4.1 mm FIELD PROGRAMMABLE GATE ARRAY - - STD - ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops 4608 4608 - - 200000 256KB - - - - - - - 28 mm 28 mm
          A2F200M3F-PQG208I
          A2F200M3F-PQG208I

          536-492-A2F200M3F-PQG208I Microchip
          RoHS :
          Package : -
          In Stock : 34
          1 : -
          M2S050-FGG484I Datasheet
          Mfr. Part #
          M2S050-FGG484I
          MOST Part #
          536-492-M2S050-FGG484I
          Microchip
          ACLM2S050-FGG484I
          2711 In Stock
            Min.:1
            Mult.:1
            - FPBGA-484 - 484-FPBGA (23x23) - - - 267 - M2S050 Microchip Technology / Atmel - - 64 kB - - - 60 SMARTFUSION2 - - - - 56340 Microchip - 166 MHz - - Microchip Technology - - Yes - Surface Mount SMD/SMT 267 4695 LAB 56340 56340 LE 1.26(V) 1.14(V) 1.2(V) -40C to 100C 100C -40C Industrial - Tray - - - - - - FPBGA - 65nm Active Yes No - - - Details - - This product may require additional documentation to export from the United States. - - - - 0.489749 oz -40°C ~ 100°C (TJ) Tray SmartFusion2 - - - - - - - - - SOC - Systems on a Chip - - - - - - - 484 - - - - - - - 166MHz 64KB ARM® Cortex®-M3 DDR, PCIe, SERDES 256 kB CANbus, Ethernet, I²C, SPI, UART/USART, USB MCU, FPGA - - - - - SoC FPGA STD - FPGA - 50K Logic Modules - - 1 Core - - 256KB - - - SoC FPGA - - - - -
            M2S050-FGG484I
            M2S050-FGG484I

            536-492-M2S050-FGG484I Microchip
            RoHS :
            Package : -
            In Stock : 2711
            1 : -
            M2S060-1FCSG325 Datasheet
            Mfr. Part #
            M2S060-1FCSG325
            MOST Part #
            536-492-M2S060-1FCSG325
            Microchip
            FPGA SmartFusion2 56520 Cells 166MHz 65nm Technology 1.2V 325-Pin F-BGA
            2389 In Stock
              Min.:1
              Mult.:1
              Production (Last Updated: 2 months ago) 325-TFBGA, FCBGA - 325-FCBGA (11x11) - - - - - M2S060 - - - 64 kB - - - - - - - - - - Miscellaneous - 166 MHz - - Microchip Technology - - - - - - 200 - - 56520 LE - - - - - - - - Tray - - - - - - - - - Active - - - - - Compliant - - - - - - 1.2000 V - 0 to 85 °C - SmartFusion®2 - - - - - - - - - - - - - - - - - - - - - - - - - 166MHz 64KB ARM® Cortex®-M3 DDR, PCIe, SERDES 256 kB CANbus, Ethernet, I²C, SPI, UART/USART, USB MCU, FPGA - - - - - - 1 - FPGA - 60K Logic Modules - - 1 Core - - 256KB - - - - - - - - -
              M2S060-1FCSG325
              M2S060-1FCSG325

              536-492-M2S060-1FCSG325 Microchip
              RoHS :
              Package : -
              In Stock : 2389
              1 : -
              M2S010-VFG256I Datasheet
              Mfr. Part #
              M2S010-VFG256I
              MOST Part #
              536-492-M2S010-VFG256I
              Microchip
              FPGA SmartFusion2 12084 Cells 166MHz 65nm 2.5V/3.3V 256-Pin FBGA
              111 In Stock
                Min.:1
                Mult.:1
                - VFPBGA-256 YES 256-FPBGA (14x14) - 256 - - UL M2S010 Microchip Technology / Atmel Cat 5e - 64 kB - - - 119 - MICROSEMI CORP TPE - - - Turck UX07628 166 MHz 1.26 V + 100 C Microchip Technology 1.14 V - 40 C Yes 3 - SMD/SMT 138 I/O 1007 LAB - 12084 LE - - - - - - - - Tray PLASTIC/EPOXY LFBGA LFBGA, BGA256,16X16,32 BGA256,16X16,32 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH - Active - Active - - - 40 5.76 Details Yes - - 1.26 V 1.14 V 1.2 V 2.5, 3.3 V - -40 to 100 °C Tray SmartFusion2 e1 - RJ45 - Tin/Silver/Copper (Sn/Ag/Cu) Teal - LG-MIN, WD-MIN 8542.39.00.01 SOC - Systems on a Chip CMOS BOTTOM BALL Yes 250 0.8 mm compliant - S-PBGA-B256 138 Not Qualified - 1.2 V 1.2 V - 166MHz 64KB ARM® Cortex®-M3 DDR, PCIe, SERDES 256 kB CANbus, Ethernet, I²C, SPI, UART/USART, USB MCU, FPGA 138 - 1.56 mm FIELD PROGRAMMABLE GATE ARRAY - SoC FPGA STD - FPGA - 10K Logic Modules - 12084 1 Core - - 256KB - - - SoC FPGA No - - 39 Feet 14 mm
                M2S010-VFG256I
                M2S010-VFG256I

                536-492-M2S010-VFG256I Microchip
                RoHS :
                Package : -
                In Stock : 111
                1 : -
                M2S050-FGG484 Datasheet
                Mfr. Part #
                M2S050-FGG484
                MOST Part #
                536-492-M2S050-FGG484
                Microchip
                FPGA SmartFusion2 56340 Cells 65nm Technology 1.2V 484-Pin FPBGA
                2845 In Stock
                  Min.:1
                  Mult.:1
                  - BGA-484 - 484-FPBGA (23x23) Polyester - - - - M2S050 Microchip Technology / Atmel - - 64 kB - 1.314 Mbit 64 kB 60 - - - - - - Brady 125819 166 MHz 1.26 V + 85 C Microchip Technology 1.14 V 0 C Yes - - SMD/SMT 267 I/O 4695 LAB - 56340 LE - - - - - - - - Tray - - - - - - - - - Active - - - - - Details - - This product may require additional documentation to export from the United States. - - - 1.2000 V - 0 to 85 °C Tray SmartFusion2 - - - Warning Signs - - - - - SOC - Systems on a Chip - - - - - - - - - - - - 1.2 V - - 166MHz 64KB ARM® Cortex®-M3 DDR, PCIe, SERDES 256 kB CANbus, Ethernet, I²C, SPI, UART/USART, USB MCU, FPGA - - - - - SoC FPGA STD Vinyl Chloride May Cause Cancer Authorized Personnel Only FPGA - 50K Logic Modules - - 1 Core White - 256KB - English - SoC FPGA - - - - -
                  M2S050-FGG484
                  M2S050-FGG484

                  536-492-M2S050-FGG484 Microchip
                  RoHS :
                  Package : -
                  In Stock : 2845
                  1 : -
                  A2F200M3F-FGG484 Datasheet
                  Mfr. Part #
                  A2F200M3F-FGG484
                  MOST Part #
                  536-492-A2F200M3F-FGG484
                  Microchip
                  ACLA2F200M3F-FGG484 SMART FUSION MIX SIG
                  155 In Stock
                    Min.:1
                    Mult.:1
                    - 484-BGA YES 484-FPBGA (23x23) - 484 - - - A2F200 - - 80 MHz - 200000 - - - - MICROSEMI CORP - - - - Cutler Hammer, Div of Eaton Co E57LBL30T110 - 1.575 V - Microchip Technology 1.425 V - - 3 - - MCU - 41, FPGA - 94 - - - - - - - - - - 85 °C Tray PLASTIC/EPOXY BGA BGA, BGA484,26X26,40 BGA484,26X26,40 SQUARE GRID ARRAY - Active - Active - - 10 mm 40 1.36 - Yes - - 1.575 V 1.425 V 1.5 V 1.5000 V - 0 to 85 °C - SmartFusion® e1 - - - Tin/Silver/Copper (Sn/Ag/Cu) - - - 8542.39.00.01 Field Programmable Gate Arrays CMOS BOTTOM BALL Shielded 250 1 mm compliant - S-PBGA-B484 94 Not Qualified NC NPN - 1.5,1.8,2.5,3.3 V OTHER 80MHz 64KB ARM® Cortex®-M3 DMA, POR, WDT - EBI/EMI, Ethernet, I²C, SPI, UART/USART MCU, FPGA 94 4608 CLBS, 200000 GATES 2.44 mm FIELD PROGRAMMABLE GATE ARRAY - - STD - ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops 4608 4608 - - 200000 256KB - - Cable Connection - - DC 30 mm 23 mm 23 mm
                    A2F200M3F-FGG484
                    A2F200M3F-FGG484

                    536-492-A2F200M3F-FGG484 Microchip
                    RoHS :
                    Package : -
                    In Stock : 155
                    1 : -
                    M2S010T-VFG256I Datasheet
                    Mfr. Part #
                    M2S010T-VFG256I
                    MOST Part #
                    536-492-M2S010T-VFG256I
                    Microchip
                    ACLM2S010T-VFG256I
                      Min.:1
                      Mult.:1
                      Production (Last Updated: 1 month ago) 256-LBGA YES 256-FPBGA (17x17) - 256 - - - M2S010 - - - 64 kB - - - - - MICROSEMI CORP - - - - GE - General Electric M2S010T-VFG256I 166 MHz - - Microchip Technology - - - 3 - SMD/SMT 138 - - 12084 LE - - - - - - - - Tray PLASTIC/EPOXY LFBGA VFBGA-256 BGA256,16X16,32 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH - Active - Active - - - 40 5.77 Non-Compliant Yes - - 1.26 V 1.14 V 1.2 V 1.2000 V - -40 to 100 °C - SmartFusion®2 e1 - - - Tin/Silver/Copper (Sn/Ag/Cu) - - LG-MIN, WD-MIN 8542.39.00.01 Field Programmable Gate Arrays CMOS BOTTOM BALL - 250 0.8 mm compliant - S-PBGA-B256 138 Not Qualified - - 1.2 V - 166MHz 64KB ARM® Cortex®-M3 DDR, PCIe, SERDES 256 kB CANbus, Ethernet, I²C, SPI, UART/USART, USB MCU, FPGA 138 - 1.56 mm FIELD PROGRAMMABLE GATE ARRAY - - STD - FPGA - 10K Logic Modules - 12084 1 Core - - 256KB - - - - - - - 14 mm 14 mm
                      M2S010T-VFG256I
                      M2S010T-VFG256I

                      536-492-M2S010T-VFG256I Microchip
                      RoHS :
                      Package : -
                      In Stock : -
                      1 : -
                      M2S090TS-FGG676I Datasheet
                      Mfr. Part #
                      M2S090TS-FGG676I
                      MOST Part #
                      536-492-M2S090TS-FGG676I
                      Microchip
                      FPGA SmartFusion2 86184 Cells 166MHz 65nm Technology 1.2V 676-Pin FBGA
                      2569 In Stock
                        Min.:1
                        Mult.:1
                        - 676-BGA - 676-FBGA (27x27) - - Plastic - - M2S090 - - - 64 kB - - - - - - - - - - Brady 109252 166 MHz - - Microchip Technology - - - - - SMD/SMT 425 - - 86316 LE - - - - - - - - Tray - - - - - - - - - Active - - - - - - - - - - - - 1.2000 V - -40 to 100 °C - SmartFusion®2 - - - - - - Pipe & Valve Marking - - - - - - - - - - - - - - - - - - 166MHz 64KB ARM® Cortex®-M3 DDR, PCIe, SERDES 512 kB CANbus, Ethernet, I²C, SPI, UART/USART, USB MCU, FPGA - - - - Yes - STD Hot Water Return FPGA - 90K Logic Modules - - 1 Core Green - 512KB White English - - - - - - -
                        M2S090TS-FGG676I
                        M2S090TS-FGG676I

                        536-492-M2S090TS-FGG676I Microchip
                        RoHS :
                        Package : -
                        In Stock : 2569
                        1 : -
                        M2S090-FGG676 Datasheet
                        Mfr. Part #
                        M2S090-FGG676
                        MOST Part #
                        536-492-M2S090-FGG676
                        Microchip
                        ACLM2S090-FGG676
                        2032 In Stock
                          Min.:1
                          Mult.:1
                          - 676-BGA YES 676-FBGA (27x27) - 676 - - - M2S090 - - - 64 kB - - - - - MICROSEMI CORP - - - - Johnson Controls VH7441GT+3008E 166 MHz - - Microchip Technology - - - 3 - - 425 - - 86316 LE - - - - - - - 85 °C Tray PLASTIC/EPOXY BGA FBGA-676 BGA676,26X26,40 SQUARE GRID ARRAY - Active - Active - - - 40 5.78 - Yes - - 1.26 V 1.14 V 1.2 V 1.2000 V - 0 to 85 °C - SmartFusion®2 e1 - - - Tin/Silver/Copper (Sn/Ag/Cu) - - - 8542.39.00.01 Field Programmable Gate Arrays CMOS BOTTOM BALL - 250 1 mm compliant - S-PBGA-B676 425 Not Qualified - - 1.2 V OTHER 166MHz 64KB ARM® Cortex®-M3 DDR, PCIe, SERDES 512 kB CANbus, Ethernet, I²C, SPI, UART/USART, USB MCU, FPGA 425 - 2.44 mm FIELD PROGRAMMABLE GATE ARRAY - - STD - FPGA - 90K Logic Modules - 86316 1 Core - - 512KB - - - - - - - 27 mm 27 mm
                          M2S090-FGG676
                          M2S090-FGG676

                          536-492-M2S090-FGG676 Microchip
                          RoHS :
                          Package : -
                          In Stock : 2032
                          1 : -
                          A2F060M3E-FG256 Datasheet
                          Mfr. Part #
                          A2F060M3E-FG256
                          MOST Part #
                          536-492-A2F060M3E-FG256
                          Microchip
                          IC SOC CORTEX-M3 80MHZ 256FBGA
                            Min.:1
                            Mult.:1
                            - - YES - - 256 - - - - - - - - - - - - - MICROSEMI CORP - - - - Microsemi Corporation A2F060M3E-FG256 - - - - - - - 3 - - - - - - - - - - - - - 85 °C - PLASTIC/EPOXY LBGA LBGA, - SQUARE GRID ARRAY, LOW PROFILE - Obsolete - - - - - 20 5.88 - No - - 1.575 V 1.425 V 1.5 V - - - - - e0 - - - Tin/Lead (Sn/Pb) - - - 8542.39.00.01 - CMOS BOTTOM BALL - 225 1 mm compliant - S-PBGA-B256 - - - - - OTHER - - - - - - - - 1536 CLBS, 60000 GATES 1.7 mm FIELD PROGRAMMABLE GATE ARRAY - - - - - 1536 - - - 60000 - - - - - - - - 17 mm 17 mm
                            A2F060M3E-FG256
                            A2F060M3E-FG256

                            536-492-A2F060M3E-FG256 Microchip
                            RoHS :
                            Package : -
                            In Stock : -
                            1 : -
                            A2F060M3E-FG256I Datasheet
                            Mfr. Part #
                            A2F060M3E-FG256I
                            MOST Part #
                            536-492-A2F060M3E-FG256I
                            Microchip
                            IC SOC CORTEX-M3 80MHZ 256FBGA
                              Min.:1
                              Mult.:1
                              - - YES - - 256 - - - - - - 80 MHz - - - - - - MICROSEMI CORP - - - - Microsemi Corporation A2F060M3E-FG256I - - - - - - - 3 - - - - - - - - - - - - - - - PLASTIC/EPOXY LBGA 1 MM PITCH, FBGA-256 BGA256,16X16,40 SQUARE GRID ARRAY, LOW PROFILE - Obsolete - - - - - 20 8.76 - No - - 1.575 V 1.425 V 1.5 V - - - - - e0 - - - Tin/Lead (Sn/Pb) - - - 8542.39.00.01 Field Programmable Gate Arrays CMOS BOTTOM BALL - 225 1 mm unknown - S-PBGA-B256 66 Not Qualified - - 1.5,1.8,2.5,3.3 V - - - - - - - - 66 1536 CLBS, 60000 GATES 1.7 mm FIELD PROGRAMMABLE GATE ARRAY - - - - - 1536 1536 - - 60000 - - - - - - - - 17 mm 17 mm
                              A2F060M3E-FG256I
                              A2F060M3E-FG256I

                              536-492-A2F060M3E-FG256I Microchip
                              RoHS :
                              Package : -
                              In Stock : -
                              1 : -
                              M2S025-VFG256I Datasheet
                              Mfr. Part #
                              M2S025-VFG256I
                              MOST Part #
                              536-492-M2S025-VFG256I
                              Microchip
                              FPGA SmartFusion2 27696 Cells 65nm Technology 1.2V 256-Pin FPBGA
                              2457 In Stock
                                Min.:1
                                Mult.:1
                                Production (Last Updated: 2 months ago) 256-LBGA - 256-FPBGA (17x17) - - - - - M2S025 Microchip Technology / Atmel - - 64 kB - - - 119 - - - - - - Microchip - 166 MHz 1.26 V + 100 C Microchip Technology 1.14 V - 40 C Yes - - SMD/SMT 138 I/O 2308 LAB - 27696 LE - - - - - - - - Tray - - - - - - - - - Active - - - - - Non-Compliant - 8542390000 - - - - 1.2000 V 0.241494 oz -40 to 100 °C Tray SmartFusion2 - - - - - - - - - SOC - Systems on a Chip - - - - - - - - - - - - 1.2 V - - 166MHz 64KB ARM® Cortex®-M3 DDR, PCIe, SERDES 256 kB CANbus, Ethernet, I²C, SPI, UART/USART, USB MCU, FPGA - - - - - SoC FPGA STD - FPGA - 25K Logic Modules - - 1 Core - - 256KB - - - SoC FPGA - - - - -
                                M2S025-VFG256I
                                M2S025-VFG256I

                                536-492-M2S025-VFG256I Microchip
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                                A2F200M3F-1CSG288I Datasheet
                                Mfr. Part #
                                A2F200M3F-1CSG288I
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                                536-492-A2F200M3F-1CSG288I
                                Microchip
                                FPGA SmartFusion 200K Gates 2000 Cells 100MHz 130nm (CMOS) Technology 1.5V 288-Pin CSP
                                37 In Stock
                                  Min.:1
                                  Mult.:1
                                  - 288-TFBGA, CSPBGA - 288-CSP (11x11) - - - - - A2F200 - - - - 200000 - - - - - - - - - - - - 1.575 V - Microchip Technology 1.425 V - - - - - MCU - 31, FPGA - 78 - - - - - - - - - - - Tray - - - - - - - - - Active - - - - - - - - - - - - 1.5000 V - -40 to 100 °C - SmartFusion® - - - - - - - - - - - - - - - - - - - - - - - - - 100MHz 64KB ARM® Cortex®-M3 DMA, POR, WDT - EBI/EMI, Ethernet, I²C, SPI, UART/USART MCU, FPGA - - - - - - 1 - ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops - - - - - 256KB - - - - - - - - -
                                  A2F200M3F-1CSG288I
                                  A2F200M3F-1CSG288I

                                  536-492-A2F200M3F-1CSG288I Microchip
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                                  M2S025-FCSG325I Datasheet
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                                  M2S025-FCSG325I
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                                  536-492-M2S025-FCSG325I
                                  Microchip
                                  FPGA SmartFusion2 Family 27696 Cells 65nm Technology 1.2V 325-Pin FC-BGA
                                  345 In Stock
                                    Min.:1
                                    Mult.:1
                                    - 325-TFBGA, FCBGA - 325-FCBGA (11x11) - - - - - M2S025 - - - 64 kB - - - - - - - - - - - - 166 MHz - + 100 C Microchip Technology - - 40 C - - - SMD/SMT 180 - - 27696 LE - - - - - - - - Tray - - - - - - - - - Active - - - - - - - - - - - - - - -40°C ~ 100°C (TJ) - SmartFusion®2 - - - - - - - - - - - - - - - - - - - - - - 1.2 V - - 166MHz 64KB ARM® Cortex®-M3 DDR, PCIe, SERDES 256 kB CANbus, Ethernet, I²C, SPI, UART/USART, USB MCU, FPGA - - - - - - - - FPGA - 25K Logic Modules - - 1 Core - - 256KB - - - - - - - - -
                                    M2S025-FCSG325I
                                    M2S025-FCSG325I

                                    536-492-M2S025-FCSG325I Microchip
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                                    M2S060TS-1FGG484T2 Datasheet
                                    Mfr. Part #
                                    M2S060TS-1FGG484T2
                                    MOST Part #
                                    536-492-M2S060TS-1FGG484T2
                                    Microchip
                                    FPGA SmartFusion2 Family 56520 Cells 65nm Technology 1.2V 484-Pin FBGA
                                    2857 In Stock
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                                      Mult.:1
                                      - 484-BGA - 484-FPBGA (23x23) - - - - - M2S060 - - - - - - - - - - - - - - - - - - - Microchip Technology - - - - - - 267 - - - - - - - - - - - Tray - - - - - - - - - Active - - - - - - - - - - - - - - -40°C ~ 125°C (TJ) - Automotive, AEC-Q100, SmartFusion®2 - - - - - - - - - - - - - - - - - - - - - - - - - 166MHz 64KB ARM® Cortex®-M3 DDR, PCIe, SERDES - CANbus, Ethernet, I²C, SPI, UART/USART, USB MCU, FPGA - - - - - - 1 - FPGA - 60K Logic Modules - - - - - 256KB - - - - - - - - -
                                      M2S060TS-1FGG484T2
                                      M2S060TS-1FGG484T2

                                      536-492-M2S060TS-1FGG484T2 Microchip
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                                      M2S025TS-1FGG484T2 Datasheet
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                                      M2S025TS-1FGG484T2
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                                      536-492-M2S025TS-1FGG484T2
                                      Microchip
                                      FPGA SmartFusion2 Family 27696 Cells 65nm Technology 1.2V 484-Pin FBGA
                                      2725 In Stock
                                        Min.:1
                                        Mult.:1
                                        - 484-BGA - 484-FPBGA (23x23) - - - - - M2S025 - - - - - - - - - - - - - - - - - - - Microchip Technology - - - - - - 267 - - - - - - - - - - - Tray - - - - - - - - - Active - - - - - - - - - - - - 1.2000 V - 0 to 85 °C - Automotive, AEC-Q100, SmartFusion®2 - - - - - - - - - - - - - - - - - - - - - - - - - 166MHz 64KB ARM® Cortex®-M3 DDR, PCIe, SERDES - CANbus, Ethernet, I²C, SPI, UART/USART, USB MCU, FPGA - - - - - - 1 - FPGA - 25K Logic Modules - - - - - 256KB - - - - - - - - -
                                        M2S025TS-1FGG484T2
                                        M2S025TS-1FGG484T2

                                        536-492-M2S025TS-1FGG484T2 Microchip
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                                        A2F060M3E-1TQG144 Datasheet
                                        Mfr. Part #
                                        A2F060M3E-1TQG144
                                        MOST Part #
                                        536-492-A2F060M3E-1TQG144
                                        Microchip
                                        IC SOC CORTEX-M3 100MHZ 144TQFP
                                          Min.:1
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                                          - - YES - - 144 - - - - - - - - - - - - - MICROSEMI CORP - - - - Microsemi Corporation A2F060M3E-1TQG144 - - - - - - - - - - - - - - - - - - - - - 85 °C - PLASTIC/EPOXY LFQFP LFQFP, - SQUARE FLATPACK, LOW PROFILE, FINE PITCH - Obsolete - - - - - - 5.81 - Yes - - 1.575 V 1.425 V 1.5 V - - - - - - - - - - - - - 8542.39.00.01 - CMOS QUAD GULL WING - - 0.5 mm compliant - S-PQFP-G144 - - - - - OTHER - - - - - - - - 1536 CLBS, 60000 GATES 1.6 mm FIELD PROGRAMMABLE GATE ARRAY - - - - - 1536 - - - 60000 - - - - - - - - 20 mm 20 mm
                                          A2F060M3E-1TQG144
                                          A2F060M3E-1TQG144

                                          536-492-A2F060M3E-1TQG144 Microchip
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                                          Embedded - System On Chip (SoC) definition: A System On Chip (SoC) combines the required electronic circuits of various computer components onto a single, integrated chip (IC). SoC is ... Embedded - System On Chip (SoC) Product Listing: M2S150-1FCG1152I,M2S010TS-1VFG400T2,A2F200M3F-CSG288,A2F200M3F-PQG208I,M2S050-FGG484I.Integrated Circuits (ICs) type:Embedded - Microcontrollers(134273),Memory(116337),PMIC - Voltage Regulators - Linear(107072),PMIC - Supervisors(101983),Embedded - FPGAs (Field Programmable Gate Array)(62862) .Embedded - System On Chip (SoC) has 873 pieces of spot stock price information, you can click the "RFQ" button to confirm the inventory and price with the MOST.

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