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Products Found
| Compare | Image | Part # | Manufacturer | Description | Availability | Pricing | Quantity | RoHS | Lifecycle Status | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of Terminals | Base Product Number | Core | Data RAM Size | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Supply Voltage | Mfr | Minimum Operating Supply Voltage | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Operating Temperature | Packaging | Series | JESD-609 Code | Pbfree Code | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Connectivity | Architecture | Number of Inputs | Seated Height-Max | Programmable Logic Type | Speed Grade | Primary Attributes | Number of Logic Cells | Number of Cores | Flash Size | Length | Width | Lead Free |
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Datasheet
| Mfr. Part #M2S005-1VF400MOST Part #536-492-M2S005-1VF400 | Microchip Technology |
SoC FPGA M2S005-1VF400
| 23
In Stock
| Min.:1 Mult.:1 | - | VFPBGA-400 | YES | - | 400-VFBGA (17x17) | 400 | M2S005 | ARM Cortex M3 | 64 kB | 90 | MICROSEMI CORP | - | - | M2S005-1VF400 | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | Yes | - | SMD/SMT | 169 | 505 LAB | 6060 LE | 85 °C | - | Tray | PLASTIC/EPOXY | LFBGA | LFBGA, BGA400,20X20,32 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 30 | 5.86 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | - | 1.2000 V | 0 to 85 °C | Tray | SmartFusion2 | e0 | - | - | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | - | S-PBGA-B400 | 160 | Not Qualified | - | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 160 | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | 1 | FPGA - 5K Logic Modules | 4956 | 1 Core | 128KB | 17 mm | 17 mm | - | |||
| M2S005-1VF400 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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Datasheet
| Mfr. Part #M2S025T-1FGG484MOST Part #536-492-M2S025T-1FGG484 | Microchip Technology |
SoC FPGA M2S025T-1FGG484
| 2770
In Stock
| Min.:1 Mult.:1 | - | FPBGA-484 | - | - | 484-FPBGA (23x23) | - | M2S025 | ARM Cortex M3 | 64 kB | 60 | - | - | - | - | 166 MHz | - | Microchip Technology | - | Yes | - | SMD/SMT | 267 | 2308 LAB | 27696 LE | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | Details | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | FPGA - 25K Logic Modules | - | 1 Core | 256KB | - | - | - | |||
| M2S025T-1FGG484 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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Datasheet
| Mfr. Part #M2S060-1FGG484MOST Part #536-492-M2S060-1FGG484 | Microchip Technology |
SoC FPGA M2S060-1FGG484
| 2011
In Stock
| Min.:1 Mult.:1 | Production (Last Updated: 2 months ago) | 484-BGA | - | 484 | 484-FPBGA (23x23) | - | M2S060 | ARM Cortex M3 | 64 kB | 60 | - | - | - | - | 166 MHz | - | Microchip Technology | - | Yes | - | - | 267 | 4710 LAB | 56520 LE | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | Details | - | This product may require additional documentation to export from the United States. | - | - | - | SmartFusion2 | - | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | - | - | - | - | 85 °C | 0 °C | - | - | - | - | - | - | - | - | - | - | - | - | 1.2 V | - | - | 166MHz | 164.3 kB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | 1 | FPGA - 60K Logic Modules | - | 1 Core | 256KB | - | - | - | |||
| M2S060-1FGG484 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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Datasheet
| Mfr. Part #M2S050T-1FG484MMOST Part #536-492-M2S050T-1FG484M | Microchip Technology |
SoC FPGA M2S050T-1FG484M
| 2270
In Stock
| Min.:1 Mult.:1 | - | FPBGA-484 | YES | - | 484-FPBGA (23x23) | 484 | M2S050 | ARM Cortex M3 | 64 kB | 60 | MICROSEMI CORP | - | - | M2S050T-1FG484M | 166 MHz | - | Microchip Technology | - | Yes | 3 | SMD/SMT | 267 | 4695 LAB | 56340 LE | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.81 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | - | - | -55°C ~ 125°C (TJ) | Tray | SmartFusion2 | e0 | - | 3A001.A.2.C | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | - | S-PBGA-B484 | 267 | Not Qualified | - | 1.2 V | MILITARY | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 267 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | FPGA - 50K Logic Modules | 56340 | 1 Core | 256KB | 23 mm | 23 mm | - | |||
| M2S050T-1FG484M | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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Datasheet
| Mfr. Part #M2S090T-1FCSG325IMOST Part #536-492-M2S090T-1FCSG325I | Microchip Technology |
SoC FPGA M2S090T-1FCSG325I
| 2277
In Stock
| Min.:1 Mult.:1 | - | FCBGA-325 | YES | - | 325-FCBGA (11x13.5) | 325 | M2S090 | ARM Cortex M3 | 64 kB | 176 | MICROSEMI CORP | - | - | M2S090T-1FCSG325I | 166 MHz | - | Microchip Technology | - | Yes | 3 | SMD/SMT | 180 | 7193 LAB | 86316 LE | - | - | Tray | PLASTIC/EPOXY | TFBGA | FBGA-325 | BGA325,21X21,20 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 40 | 5.78 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | - | - | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e1 | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 0.5 mm | compliant | - | R-PBGA-B325 | 180 | Not Qualified | - | 1.2 V | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 180 | 1.16 mm | FIELD PROGRAMMABLE GATE ARRAY | - | FPGA - 90K Logic Modules | 86316 | 1 Core | 512KB | 13.5 mm | 11 mm | - | |||
| M2S090T-1FCSG325I | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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Datasheet
| Mfr. Part #M2S150TS-FCVG484IMOST Part #536-492-M2S150TS-FCVG484I | Microchip Technology |
SoC FPGA M2S150TS-FCVG484I
| 679
In Stock
| Min.:1 Mult.:1 | - | 484-BFBGA | YES | - | 484-FBGA (19x19) | 484 | M2S150 | ARM Cortex M3 | 64 kB | 84 | MICROSEMI CORP | - | - | M2S150TS-FCVG484I | 166 MHz | - | Microchip Technology | - | Yes | 4 | - | 273 | 12177 LAB | 146124 LE | - | - | Tray | PLASTIC/EPOXY | FBGA | VFBGA-484 | - | SQUARE | GRID ARRAY, FINE PITCH | Active | Active | 40 | 5.82 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | - | - | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e1 | Yes | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | LG-MIN, WD-MIN | 8542.39.00.01 | - | BOTTOM | BALL | 250 | 0.8 mm | compliant | - | S-PBGA-B484 | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | 3.15 mm | FIELD PROGRAMMABLE GATE ARRAY | - | FPGA - 150K Logic Modules | - | 1 Core | 512KB | 19 mm | 19 mm | - | |||
| M2S150TS-FCVG484I | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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Datasheet
| Mfr. Part #M2S010-VF400IMOST Part #536-492-M2S010-VF400I | Microchip Technology |
SoC FPGA M2S010-VF400I
| 30
In Stock
| Min.:1 Mult.:1 | - | VFPBGA-400 | - | - | 400-VFBGA (17x17) | - | M2S010 | ARM Cortex M3 | 64 kB | 90 | - | - | - | - | 166 MHz | - | Microchip Technology | - | Yes | - | SMD/SMT | 195 | 1007 LAB | 12084 LE | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | N | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | FPGA - 10K Logic Modules | - | 1 Core | 256KB | - | - | - | |||
| M2S010-VF400I | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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Datasheet
| Mfr. Part #M2S050TS-FCSG325MOST Part #536-492-M2S050TS-FCSG325 | Microchip Technology |
SoC FPGA M2S050TS-FCSG325
| 2924
In Stock
| Min.:1 Mult.:1 | Production (Last Updated: 2 months ago) | 325-TFBGA, FCBGA | - | - | 325-FCBGA (11x11) | - | M2S050 | ARM Cortex M3 | 64 kB | 176 | - | - | - | - | 166 MHz | - | Microchip Technology | - | Yes | - | - | 200 | 4695 LAB | 56340 LE | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | Details | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | FPGA - 50K Logic Modules | - | 1 Core | 256KB | - | - | - | |||
| M2S050TS-FCSG325 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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Datasheet
| Mfr. Part #M2S010T-1FGG484MOST Part #536-492-M2S010T-1FGG484 | Microchip Technology |
SoC FPGA M2S010T-1FGG484
| 133
In Stock
| Min.:1 Mult.:1 | - | FPBGA-484 | - | - | 484-FPBGA (23x23) | - | M2S010 | ARM Cortex M3 | 64 kB | 60 | - | - | - | - | 166 MHz | - | Microchip Technology | - | Yes | - | SMD/SMT | 233 | 1007 LAB | 12084 LE | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | Details | - | - | - | - | - | - | 1.2000 V | 0 to 85 °C | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | 1 | FPGA - 10K Logic Modules | - | 1 Core | 256KB | - | - | - | |||
| M2S010T-1FGG484 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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Datasheet
| Mfr. Part #M2S025-FCS325MOST Part #536-492-M2S025-FCS325 | Microchip Technology |
SoC FPGA M2S025-FCS325
| 39
In Stock
| Min.:1 Mult.:1 | Production (Last Updated: 2 months ago) | 325-TFBGA, FCBGA | - | - | 325-FCBGA (11x11) | - | M2S025 | ARM Cortex M3 | 64 kB | 176 | - | - | - | - | 166 MHz | - | Microchip Technology | - | Yes | - | - | 180 | 2308 LAB | 27696 LE | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | N | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | FPGA - 25K Logic Modules | - | 1 Core | 256KB | - | - | - | |||
| M2S025-FCS325 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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Datasheet
| Mfr. Part #M2S060T-FCS325MOST Part #536-492-M2S060T-FCS325 | Microchip Technology |
SoC FPGA M2S060T-FCS325
| 2153
In Stock
| Min.:1 Mult.:1 | Production (Last Updated: 2 months ago) | 325-TFBGA, FCBGA | YES | - | 325-FCBGA (11x11) | 325 | M2S060 | ARM Cortex M3 | 64 kB | 176 | MICROSEMI CORP | - | - | M2S060T-FCS325 | 166 MHz | - | Microchip Technology | - | Yes | - | - | 200 | 4710 LAB | 56520 LE | 85 °C | - | Tray | PLASTIC/EPOXY | TFBGA | FBGA-325 | BGA325,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 30 | 5.87 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | SmartFusion2 | - | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e0 | - | - | Tin/Lead (Sn/Pb) | - | - | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.5 mm | not_compliant | - | S-PBGA-B325 | 200 | Not Qualified | - | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 200 | 1.01 mm | FIELD PROGRAMMABLE GATE ARRAY | - | FPGA - 60K Logic Modules | 56520 | 1 Core | 256KB | 11 mm | 11 mm | - | |||
| M2S060T-FCS325 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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Datasheet
| Mfr. Part #M2S025T-VF400MOST Part #536-492-M2S025T-VF400 | Microchip Technology |
SoC FPGA M2S025T-VF400
| 2822
In Stock
| Min.:1 Mult.:1 | - | 400-LFBGA | YES | - | 400-VFBGA (17x17) | 400 | M2S025 | ARM Cortex M3 | 64 kB | 90 | MICROSEMI CORP | - | - | M2S025T-VF400 | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | Yes | - | - | 207 | 2308 LAB | 27696 LE | 85 °C | - | Tray | PLASTIC/EPOXY | LFBGA | LFBGA, BGA400,20X20,32 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 30 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | - | 1.2000 V | 0 to 85 °C | Tray | SmartFusion2 | e0 | - | - | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | - | S-PBGA-B400 | 160 | Not Qualified | - | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 160 | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | STD | FPGA - 25K Logic Modules | 23988 | 1 Core | 256KB | 17 mm | 17 mm | - | |||
| M2S025T-VF400 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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Datasheet
| Mfr. Part #M2S010-VF256IMOST Part #536-492-M2S010-VF256I | Microchip Technology |
SoC FPGA M2S010-VF256I
| 117
In Stock
| Min.:1 Mult.:1 | - | VFPBGA-256 | YES | - | 256-FPBGA (14x14) | 256 | M2S010 | ARM Cortex M3 | 64 kB | 119 | MICROSEMI CORP | - | - | M2S010-VF256I | 166 MHz | - | Microchip Technology | - | Yes | - | SMD/SMT | 138 | 1007 LAB | 12084 LE | - | - | Tray | PLASTIC/EPOXY | LFBGA | LFBGA, BGA256,16X16,32 | BGA256,16X16,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 30 | 5.81 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | - | - | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e0 | - | - | Tin/Lead (Sn/Pb) | - | - | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | - | S-PBGA-B256 | 138 | Not Qualified | - | 1.2 V | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 138 | 1.56 mm | FIELD PROGRAMMABLE GATE ARRAY | - | FPGA - 10K Logic Modules | 12084 | 1 Core | 256KB | 14 mm | 14 mm | - | |||
| M2S010-VF256I | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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Datasheet
| Mfr. Part #M2S150-FCSG536IMOST Part #536-492-M2S150-FCSG536I | Microchip Technology |
SoC FPGA M2S150-FCSG536I
| 2993
In Stock
| Min.:1 Mult.:1 | - | 536-LFBGA, CSPBGA | - | - | 536-CSPBGA (16x16) | - | M2S150 | ARM Cortex M3 | 64 kB | 90 | - | - | - | - | 166 MHz | - | Microchip Technology | - | Yes | - | - | 293 | 12177 LAB | 146124 LE | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | Details | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | FPGA - 150K Logic Modules | - | 1 Core | 512KB | - | - | - | |||
| M2S150-FCSG536I | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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Datasheet
| Mfr. Part #M2S060-VFG400IMOST Part #536-492-M2S060-VFG400I | Microchip Technology |
SoC FPGA M2S060-VFG400I
| 2480
In Stock
| Min.:1 Mult.:1 | Production (Last Updated: 2 months ago) | 400-LFBGA | YES | - | 400-VFBGA (17x17) | 400 | M2S060 | ARM Cortex M3 | 64 kB | 90 | MICROSEMI CORP | - | - | M2S060-VFG400I | 166 MHz | - | Microchip Technology | - | Yes | 3 | - | 207 | 4710 LAB | 56520 LE | - | - | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-400 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 40 | 5.81 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | SmartFusion2 | 1.2000 V | -40 to 100 °C | Tray | SmartFusion2 | e1 | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 0.8 mm | compliant | - | S-PBGA-B400 | 207 | Not Qualified | - | 1.2 V | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 207 | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | STD | FPGA - 60K Logic Modules | 56520 | 1 Core | 256KB | 17 mm | 17 mm | - | |||
| M2S060-VFG400I | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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Datasheet
| Mfr. Part #M2S050T-FCS325MOST Part #536-492-M2S050T-FCS325 | Microchip Technology |
SoC FPGA M2S050T-FCS325
| 2719
In Stock
| Min.:1 Mult.:1 | Production (Last Updated: 2 months ago) | 325-TFBGA, FCBGA | YES | - | 325-FCBGA (11x11) | 325 | M2S050 | ARM Cortex M3 | 64 kB | 176 | MICROSEMI CORP | - | - | M2S050T-FCS325 | 166 MHz | - | Microchip Technology | - | Yes | - | - | 200 | 4695 LAB | 56340 LE | 85 °C | - | Tray | PLASTIC/EPOXY | TFBGA | FBGA-325 | BGA325,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 30 | 5.81 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | - | - | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e0 | - | - | Tin/Lead (Sn/Pb) | - | - | LG-MIN, WD-MIN | - | CMOS | BOTTOM | BALL | 240 | 0.5 mm | not_compliant | - | S-PBGA-B325 | 200 | Not Qualified | - | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 200 | 1.01 mm | FIELD PROGRAMMABLE GATE ARRAY | - | FPGA - 50K Logic Modules | 56340 | 1 Core | 256KB | 11 mm | 11 mm | - | |||
| M2S050T-FCS325 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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Datasheet
| Mfr. Part #M2S050-1FCSG325IMOST Part #536-492-M2S050-1FCSG325I | Microchip Technology |
SoC FPGA M2S050-1FCSG325I
| 2218
In Stock
| Min.:1 Mult.:1 | Production (Last Updated: 2 months ago) | FCBGA-325 | YES | - | 325-FCBGA (11x11) | 325 | M2S050 | ARM Cortex M3 | 64 kB | 176 | MICROSEMI CORP | - | - | M2S050-1FCSG325I | 166 MHz | - | Microchip Technology | - | Yes | 3 | SMD/SMT | 200 | 4695 LAB | 56340 LE | - | - | Tray | PLASTIC/EPOXY | TFBGA | TFBGA, BGA325,21X21,20 | BGA325,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 40 | 5.76 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | - | 1.2000 V | -40 to 100 °C | Tray | SmartFusion2 | e1 | - | 3A991.D | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 0.5 mm | compliant | - | S-PBGA-B325 | 200 | Not Qualified | - | 1.2 V | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 200 | 1.01 mm | FIELD PROGRAMMABLE GATE ARRAY | 1 | FPGA - 50K Logic Modules | 56340 | 1 Core | 256KB | 11 mm | 11 mm | Lead Free | |||
| M2S050-1FCSG325I | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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Datasheet
| Mfr. Part #M2S050T-1FG896MOST Part #536-492-M2S050T-1FG896 | Microchip Technology |
SoC FPGA M2S050T-1FG896
| 2265
In Stock
| Min.:1 Mult.:1 | - | FPBGA-896 | - | - | 896-FBGA (31x31) | - | M2S050 | ARM Cortex M3 | 64 kB | 27 | - | - | - | - | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | Yes | - | SMD/SMT | 377 | 4695 LAB | 56340 LE | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | N | - | This product may require additional documentation to export from the United States. | - | - | - | - | 1.2000 V | 0 to 85 °C | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 896 | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | 1 | FPGA - 50K Logic Modules | - | 1 Core | 256KB | - | - | - | |||
| M2S050T-1FG896 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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Datasheet
| Mfr. Part #M2S060TS-1VF400MOST Part #536-492-M2S060TS-1VF400 | Microchip Technology |
SoC FPGA M2S060TS-1VF400
| 2448
In Stock
| Min.:1 Mult.:1 | Production (Last Updated: 2 months ago) | 400-LFBGA | - | - | 400-VFBGA (17x17) | - | M2S060 | ARM Cortex M3 | 64 kB | 90 | - | - | - | - | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | Yes | - | - | 207 | 4710 LAB | 56520 LE | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | N | - | This product may require additional documentation to export from the United States. | - | - | - | SmartFusion2 | 1.2 V | 0 to 85 °C | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | 1 | FPGA - 60K Logic Modules | - | 1 Core | 256KB | - | - | - | |||
| M2S060TS-1VF400 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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Datasheet
| Mfr. Part #M2S090-1FG676MOST Part #536-492-M2S090-1FG676 | Microchip Technology |
SoC FPGA M2S090-1FG676
| 2835
In Stock
| Min.:1 Mult.:1 | - | BGA-676 | YES | - | 676-FBGA (27x27) | 676 | M2S090 | ARM Cortex M3 | 64 kB | 40 | MICROSEMI CORP | - | - | M2S090-1FG676 | 166 MHz | - | Microchip Technology | - | Yes | 3 | SMD/SMT | 425 | 7193 LAB | 86316 LE | 85 °C | - | Tray | PLASTIC/EPOXY | BGA | FBGA-676 | BGA676,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.27 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | - | - | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e0 | - | - | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | - | S-PBGA-B676 | 425 | Not Qualified | - | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 425 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | FPGA - 90K Logic Modules | 86316 | 1 Core | 512KB | 27 mm | 27 mm | - | |||
| M2S090-1FG676 |
Embedded - System On Chip (SoC) definition: A System On Chip (SoC) combines the required electronic circuits of various computer components onto a single, integrated chip (IC). SoC is ... Embedded - System On Chip (SoC) Product Listing: M2S005-1VF400,M2S025T-1FGG484,M2S060-1FGG484,M2S050T-1FG484M,M2S090T-1FCSG325I.Integrated Circuits (ICs) type:Embedded - Microcontrollers(134273),Memory(116337),PMIC - Voltage Regulators - Linear(107072),PMIC - Supervisors(101983),Embedded - FPGAs (Field Programmable Gate Array)(62862) .Embedded - System On Chip (SoC) has 873 pieces of spot stock price information, you can click the "RFQ" button to confirm the inventory and price with the MOST.
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