M393B2G70BH0-CMA Tech Specifications

Samsung  M393B2G70BH0-CMA technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Product Attribute Attribute Value
Category Memory Cards
Manufacturer Samsung
ECCN (US) 4A994.a
Module DRAM Module
Module Density 16Gbyte
Number of Chip per Module 36Chip per Modules
Chip Density (bit) 4G
Data Bus Width (bit) 72
Max. Access Time (ns) 20
Maximum Clock Rate (MHz) 1866
Chip Configuration 1Gx4
Chip Package Type FBGA
Minimum Operating Supply Voltage (V) 1.425
Typical Operating Supply Voltage (V) 1.5
Maximum Operating Supply Voltage (V) 1.575
Operating Current (mA) 2800
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 95
Module Sides Double
ECC Support Yes
Product Attribute Attribute Value
Number of Ranks DualRank
Number of Chip Banks 8Chip Banks
CAS Latency 13
SPD EEPROM Support Yes
Standard Package Name DIMM
Supplier Package RDIMM
Mounting Socket
Package Height 30
Package Length 133.35
Package Width 4(Max)
PCB changed 240
Lead Shape No Lead
Part Status Obsolete
Pin Count 240
Organization 2Gx72
PLL No
Self Refresh Yes
Module Type 240RDIMM
RoHS Status RoHS Compliant
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M393B2G70BH0-CMA Documents

Download datasheets and manufacturer documentation for   M393B2G70BH0-CMA

Others include   "M393B"   parts

The following parts include  'M393B'

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M393B2K70CM0-CF8 Samsung Electronics -
M393B2G70EB0-YK0 Samsung Electronics - 2000
M393B2G70QH0-YK0 Samsung Electronics -
M393B4G70BM0-YH9 Samsung Electronics -
M393B1G70QH0-CMA0 Samsung Electronics -
M393B1G70BH0-YK0 Samsung Electronics -
M393B5273DH0-CK0 Samsung Electronics -
M393B5273DH0-CH9 Samsung Electronics -
M393B2G70QH0-CMA0 Samsung Electronics -
M393B1G70EB0-YK0 Samsung Electronics - 48

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M393B2G70BH0-CMA Comments

109 reviews

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2020-11-11 00:00:00

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2020-10-20 00:00:00

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2020-10-09 00:00:00

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2020-09-28 00:00:00

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2020-07-03 00:00:00

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