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Compare Image Part # Manufacturer Description Availability Pricing Quantity RoHS Factory Lead TimeSize / DimensionPart StatusMoisture Sensitivity Level (MSL)TypeColorShelf LifeStorage/Refrigeration TemperatureShelf Life StartThermal ConductivityUsable Temperature RangeRoHS Status
TC2-50G Datasheet
Mfr. Part #
TC2-50G
MOST Part #
138-385-TC2-50G		 Chip Quik Inc.
HEAT SINK COMPOUND - GREY ULTRA
    Min.:1
    Mult.:1
    		 4 Weeks 50 gram Jar Active Not Applicable Silicone Compound Gray 24 Months 37°F~77°F 3°C~25°C - 4.30W/m-K -68°F~77°F -20°C~25°C ROHS3 Compliant
    TC2-50G
    TC2-50G

    138-385-TC2-50G Chip Quik Inc.
    RoHS :
    Package : -
    In Stock : -
    1 : -
    		TC2-10G Datasheet
    Mfr. Part #
    TC2-10G
    MOST Part #
    138-385-TC2-10G    		 Chip Quik Inc.
    HEAT SINK COMPOUND - GREY ULTRA
      Min.:1
      Mult.:1
      		 4 Weeks 10 gram Syringe Active Not Applicable Silicone Compound Gray 24 Months 37°F~77°F 3°C~25°C - 4.30W/m-K -68°F~77°F -20°C~25°C ROHS3 Compliant
      TC2-10G
      TC2-10G

      138-385-TC2-10G Chip Quik Inc.
      RoHS :
      Package : -
      In Stock : -
      1 : -
      		TC1-10G Datasheet
      Mfr. Part #
      TC1-10G
      MOST Part #
      138-385-TC1-10G      		 Chip Quik Inc.
      HEAT SINK COMPOUND - HIGH DENSIT
        Min.:1
        Mult.:1
        		 4 Weeks 10 gram Syringe Active Not Applicable Silicone Compound White 60 Months 37°F~77°F 3°C~25°C Date of Manufacture 0.67W/m-K - ROHS3 Compliant
        TC1-10G
        TC1-10G

        138-385-TC1-10G Chip Quik Inc.
        RoHS :
        Package : -
        In Stock : -
        1 : -
        		TC1-200G Datasheet
        Mfr. Part #
        TC1-200G
        MOST Part #
        138-385-TC1-200G        		 Chip Quik Inc.
        HEAT SINK COMPOUND - HIGH DENSIT
          Min.:1
          Mult.:1
          		 4 Weeks 200 gram Jar Active Not Applicable Silicone Compound White 60 Months 37°F~77°F 3°C~25°C Date of Manufacture 0.67W/m-K - ROHS3 Compliant
          TC1-200G
          TC1-200G

          138-385-TC1-200G Chip Quik Inc.
          RoHS :
          Package : -
          In Stock : -
          1 : -
          		TC1-20G Datasheet
          Mfr. Part #
          TC1-20G
          MOST Part #
          138-385-TC1-20G          		 Chip Quik Inc.
          HEAT SINK COMPOUND - HIGH DENSIT
            Min.:1
            Mult.:1
            		 4 Weeks 20 gram Syringe Active Not Applicable Silicone Compound White 60 Months 37°F~77°F 3°C~25°C Date of Manufacture 0.67W/m-K - ROHS3 Compliant
            TC1-20G
            TC1-20G

            138-385-TC1-20G Chip Quik Inc.
            RoHS :
            Package : -
            In Stock : -
            1 : -
            		TC2-20G Datasheet
            Mfr. Part #
            TC2-20G
            MOST Part #
            138-385-TC2-20G            		 Chip Quik Inc.
            HEAT SINK COMPOUND - GREY ULTRA
              Min.:1
              Mult.:1
              		 4 Weeks 20 gram Syringe Active Not Applicable Silicone Compound Gray 24 Months 37°F~77°F 3°C~25°C - 4.30W/m-K -68°F~77°F -20°C~25°C ROHS3 Compliant
              TC2-20G
              TC2-20G

              138-385-TC2-20G Chip Quik Inc.
              RoHS :
              Package : -
              In Stock : -
              1 : -

              Thermal - Adhesives, Epoxies, Greases, Pastes definition: Thermal adhesive is a type of thermally conductive glue used for electronic components and heat sinks. It is commonly used to bond integrate... Thermal - Adhesives, Epoxies, Greases, Pastes Product Listing: TC2-50G,TC2-10G,TC1-10G,TC1-200G,TC1-20G.Fans, Thermal Management type:Thermal - Heat Sinks(119066),DC Brushless Fans (BLDC)(31200),Thermal - Pads, Sheets(15490),AC Fans(6243),Thermal - Accessories(5231) .Thermal - Adhesives, Epoxies, Greases, Pastes has 6 pieces of spot stock price information, you can click the "RFQ" button to confirm the inventory and price with the MOST.