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- MB9AF156MBBGL-GE1
Cypress Semiconductor MB9AF156MBBGL-GE1 MCU 64KB 1.65 V ~ 3.6 V
MB9AF156MBBGL-GE1
603-488-MB9AF156MBBGL-GE1
96-LFBGA
RoHS Compliant
Core Size: 32-Bit,Package / Case: 96-LFBGA,Series: FM3 MB9A150RB,Frequency: 40 MHz,Program Memory Size: 512KB
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MB9AF156MBBGL-GE1 Tech Specifications
Cypress MB9AF156MBBGL-GE1 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Product Attribute | Attribute Value | |
|---|---|---|
| Category | Embedded - Microcontrollers | |
| Manufacturer | Cypress | |
| Package / Case | 96-LFBGA | |
| Number of Pins | 96Pins | |
| Supplier Device Package | 96-FBGA (6x6) | |
| ECCN (US) | EAR99 | |
| Family Name | FM3 | |
| Instruction Set Architecture | RISC | |
| Maximum CPU Frequency (MHz) | 40 | |
| Maximum Clock Rate (MHz) | 40 | |
| Data Bus Width (bit) | 32 | |
| Programmability | Yes | |
| Interface Type | I2C/UART | |
| Number of I/Os | 66I/Os | |
| No. of Timers | 2 | |
| Number of ADCs | DualADC | |
| ADC Resolution (bit) | 12/12 | |
| USART | 0 | |
| UART | 1 | |
| I2C | 1 | |
| I2S | 0 | |
| Minimum Operating Supply Voltage (V) | 1.65 | |
| Typical Operating Supply Voltage (V) | 3.3 | |
| Maximum Operating Supply Voltage (V) | 3.6 | |
| Minimum Operating Temperature (°C) | -40 | |
| Maximum Operating Temperature (°C) | 85 | |
| CECC Qualified | No | |
| Standard Package Name | BGA | |
| Supplier Package | FBGA | |
| Mounting | Surface Mount | |
| Package Height | 0.9 | |
| Package Length | 6 | |
| Package Width | 6 | |
| PCB changed | 96 | |
| Lead Shape | Ball | |
| Data Converters | A/D 17x12b | |
| RoHS | Compliant | |
| Memory Types | FLASH | |
| Package Description | , | |
| Reflow Temperature-Max (s) | NOT SPECIFIED |
| Product Attribute | Attribute Value | |
|---|---|---|
| Rohs Code | Yes | |
| Manufacturer Part Number | MB9AF156MBBGL-GE1 | |
| Manufacturer | Cypress Semiconductor | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | CYPRESS SEMICONDUCTOR CORP | |
| Risk Rank | 5.7 | |
| Packaging | Tray | |
| Series | FM3 MB9A150RB | |
| Operating Temperature | -40°C ~ 85°C (TA) | |
| Part Status | Obsolete | |
| Max Operating Temperature | 85 °C | |
| Min Operating Temperature | -40 °C | |
| HTS Code | 8542.31.00.01 | |
| Technology | CMOS | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Reach Compliance Code | compliant | |
| Frequency | 40 MHz | |
| Pin Count | 96 | |
| Interface | EBI/EMI, I2C, SPI, UART, USART | |
| Memory Size | 544 kB | |
| Oscillator Type | Internal | |
| Speed | 40MHz | |
| RAM Size | 64KB | |
| Voltage - Supply (Vcc/Vdd) | 1.65 V ~ 3.6 V | |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC | |
| Core Processor | ARM® Cortex®-M3 | |
| Peripherals | DMA, LVD, POR, PWM, WDT | |
| Program Memory Type | Flash | |
| Core Size | 32-Bit | |
| Program Memory Size | 512KB | |
| Connectivity | CSIO, EBI/EMI, I²C, SPI, UART/USART | |
| Core Architecture | ARM | |
| EEPROM Size | -- | |
| Ethernet | 0 | |
| USB | 0 | |
| SPI | 0 | |
| CAN | 0 | |
| ADC Channels | 17/17 | |
| Device Core | ARM Cortex M3 | |
| RoHS Status | RoHS Compliant |
MB9AF156MBBGL-GE1 Documents
Download datasheets and manufacturer documentation for MB9AF156MBBGL-GE1
Others include "MB9AF" parts
The following parts include 'MB9AF'
| Part # | Manufacturer | Package | Availability |
|---|---|---|---|
| MB9AF156MBBGL-GE1 | Cypress Semiconductor | 96-LFBGA |
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MB9AF156MBBGL-GE1 Comments
109 reviews
2024-03-06 00:00:00
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2024-03-04 15:56:56
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2023-11-28 00:00:00
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2023-11-21 00:00:00
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