M2S060-FCSG325I Tech Specifications

Microchip  M2S060-FCSG325I technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Product Attribute Attribute Value
Category Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Manufacturer Microchip
Lifecycle Status Production (Last Updated: 2 months ago)
Surface Mount YES
Package / Case 325-TFBGA, FCBGA
Number of Pins 325Pins
Supplier Device Package 325-FCBGA (11x11)
Number of Terminals 325Terminals
Manufacturer Part Number M2S060-FCSG325I
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer MICROSEMI CORP
Package Description FBGA-325
Risk Rank 5.79
Moisture Sensitivity Levels 3
Package Body Material PLASTIC/EPOXY
Package Code TFBGA
Package Equivalence Code BGA325,21X21,20
Package Shape SQUARE
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH
Supply Voltage-Max 1.26 V
Supply Voltage-Nom 1.2 V
Reflow Temperature-Max (s) 40
Typical Operating Supply Voltage 1.2000 V
Minimum Operating Supply Voltage 1.14 V
Maximum Operating Supply Voltage 1.26 V
Number of I/Os 200I/Os
Package Tray
Base Product Number M2S060
Mfr Microchip Technology
Product Status Active
RoHS Compliant
L1 Cache Instruction Memory -
Maximum Clock Frequency 166 MHz
Number of Logic Elements 56520 LELogic Element
Maximum Operating Temperature + 100 C
Minimum Operating Temperature - 40 C
L1 Cache Data Memory -
Product Attribute Attribute Value
Data RAM Size 64 kB
Supply Voltage-Min 1.14 V
Operating Temperature -40 to 100 °C
Series SmartFusion®2
JESD-609 Code e1
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Max Operating Temperature 100 °C
Min Operating Temperature -40 °C
Additional Feature LG-MIN, WD-MIN
HTS Code 8542.39.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 250
Terminal Pitch 0.5 mm
Reach Compliance Code compliant
JESD-30 Code S-PBGA-B325
Number of Outputs 200Outputs
Qualification Status Not Qualified
Operating Supply Voltage 1.2 V
Power Supplies 1.2 V
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Program Memory Size 256 kB
Connectivity CANbus, Ethernet, I²C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 200Inputs
Seated Height-Max 1.01 mm
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Speed Grade STD
Primary Attributes FPGA - 60K Logic Modules
Number of Logic Cells 56520Logic Cells
Number of Cores 1 CoreCore
Flash Size 256KB
Length 11 mm
Width 11 mm
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M2S060-FCSG325I Microchip 325-TFBGA, FCBGA 2240

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M2S060-FCSG325I Comments

109 reviews

Bradley
2021-06-11 00:00:00

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2021-06-10 00:00:00

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2021-06-04 00:00:00

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2021-03-12 00:00:00

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2021-03-03 00:00:00

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