LPC812M101JDH20 Tech Specifications

NXP  LPC812M101JDH20 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Product Attribute Attribute Value
Category Embedded - Microcontrollers
Manufacturer NXP
Surface Mount YES
Number of Terminals 20Terminals
ECCN (US) EAR99
Family Name LPC800
Instruction Set Architecture RISC
Maximum CPU Frequency (MHz) 30
Maximum Clock Rate (MHz) 30
Data Bus Width (bit) 32
Programmability Yes
Interface Type I2C/SPI/USART
Number of I/Os 18I/Os
No. of Timers 3
USART 3
UART 0
I2C 1
I2S 0
Watchdog 1
Analog Comparators 1
Parallel Master Port No
Real Time Clock No
Minimum Operating Supply Voltage (V) 1.8
Typical Operating Supply Voltage (V) 3.3
Maximum Operating Supply Voltage (V) 3.6
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
CECC Qualified No
Standard Package Name SOP
Supplier Package TSSOP
Mounting Surface Mount
Package Height 0.95(Max)
Package Length 6.6(Max)
Package Width 4.5(Max)
PCB changed 20
Lead Shape Gull-wing
Package Description TSSOP,
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Package Body Material PLASTIC/EPOXY
Operating Temperature-Min -40 °C
Supply Voltage-Nom 3.3 V
Supply Voltage-Min 1.8 V
Operating Temperature-Max 105 °C
Product Attribute Attribute Value
Manufacturer Part Number LPC812M101JDH20
RAM(byte) 4096
Clock Frequency-Max 25 MHz
Package Code TSSOP
Package Shape RECTANGULAR
Manufacturer NXP Semiconductors
ROM(word) 16384
Part Life Cycle Code Active
Number of I/O Lines 18I/O Lines
Ihs Manufacturer NXP SEMICONDUCTORS
Supply Voltage-Max 3.6 V
Risk Rank 5.71
Part Status Active
Technology CMOS
Terminal Position DUAL
Terminal Form GULL WING
Terminal Pitch 0.65 mm
Reach Compliance Code unknown
Pin Count 20
JESD-30 Code R-PDSO-G20
Temperature Grade INDUSTRIAL
Speed 30 MHz
RAM Size 4KB
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC
Program Memory Type Flash
Program Memory Size 16KB
Bit Size 32
Has ADC NO
DMA Channels NO
PWM Channels YES
DAC Channels NO
Seated Height-Max 1.1 mm
Core Architecture ARM
On Chip Program ROM Width 8
Ethernet 0
USB 0
ROM Programmability FLASH
SPI 2
Device Core ARM Cortex M0+
Width 4.4 mm
Length 6.5 mm
RoHS Status RoHS Compliant
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LPC812M101JDH20 Documents

Download datasheets and manufacturer documentation for   LPC812M101JDH20

Others include   "LPC81"   parts

The following parts include  'LPC81'

Part # Manufacturer Package Availability
LPC812M101JDH20FP NXP USA Inc. 20-TSSOP (0.173, 4.40mm Width) 1
LPC812M101JDH16J NXP USA Inc. 16-TSSOP (0.173, 4.40mm Width) 3552
LPC811M001JDH16J NXP USA Inc. 16-TSSOP (0.173, 4.40mm Width) 2188
LPC812M101JTB16X NXP USA Inc. 16-XFDFN 8000
LPC812M101JDH20J NXP USA Inc. 20-TSSOP (0.173, 4.40mm Width) 10000
LPC812M101JD20FP NXP USA Inc. 20-SOIC (0.295, 7.50mm Width) 609
LPC812M101JDH16FP NXP USA Inc. 16-TSSOP (0.173, 4.40mm Width) 40000
LPC811M001JDH16FP NXP USA Inc. 16-TSSOP (0.173, 4.40mm Width) 2492
LPC812M101FD20FP NXP USA Inc. 20-SOIC (0.295, 7.50mm Width)
LPC812M101FDH20FP NXP USA Inc. 20-TSSOP (0.173, 4.40mm Width)

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