MC56F8013VFAE Tech Specifications

NXP  MC56F8013VFAE technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Product Attribute Attribute Value
Category Embedded - Microcontrollers
Manufacturer NXP
Factory Lead Time 10 Weeks
Mounting Type Surface Mount
Package / Case 32-LQFP
Surface Mount YES
Data Converters A/D 6x12b
Number of I/Os 26I/Os
ROM(word) 16384
Operating Temperature -40°C~105°C TA
Packaging Tray
Series 56F8xxx
Published 1998
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 32Terminations
ECCN Code 3A991.A.2
Terminal Finish Matte Tin (Sn)
HTS Code 8542.31.00.01
Terminal Position QUAD
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Supply Voltage 3.3V
Terminal Pitch 0.8mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number MC56F8013
Product Attribute Attribute Value
JESD-30 Code S-PQFP-G32
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.6V
Power Supplies 3.3V
Supply Voltage-Min (Vsup) 3V
Oscillator Type Internal
Speed 32MHz
RAM Size 2K x 16
Voltage - Supply (Vcc/Vdd) 3V~3.6V
uPs/uCs/Peripheral ICs Type DIGITAL SIGNAL PROCESSOR, OTHER
Core Processor 56800E
Peripherals POR, PWM, WDT
Clock Frequency 8MHz
Program Memory Type FLASH
Core Size 16-Bit
Program Memory Size 16KB 8K x 16
Connectivity I2C, SCI, SPI
Bit Size 16
Boundary Scan YES
Low Power Mode YES
Format FIXED POINT
Barrel Shifter YES
Internal Bus Architecture MULTIPLE
Length 7mm
Height Seated (Max) 1.6mm
Width 7mm
RoHS Status ROHS3 Compliant
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MC56F8013VFAE Documents

Download datasheets and manufacturer documentation for   MC56F8013VFAE

Others include   "MC56F"   parts

The following parts include  'MC56F'

Part # Manufacturer Package Availability
MC56F8013VFAE NXP USA Inc. 32-LQFP 1000
MC56F8013VFAER2 NXP USA Inc. 32-LQFP 32

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MC56F8013VFAE Comments

109 reviews

Bradley
2021-06-11 00:00:00

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2021-06-10 00:00:00

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2021-04-24 00:00:00

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2021-03-13 00:00:00

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2021-03-12 00:00:00

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2021-03-03 00:00:00

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