MC9S08PA32AVLF Tech Specifications

NXP  MC9S08PA32AVLF technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Product Attribute Attribute Value
Category Embedded - Microcontrollers
Manufacturer NXP
Factory Lead Time 20 Weeks
Mounting Type Surface Mount
Package / Case 48-LQFP
Surface Mount YES
Data Converters A/D 12x12b
Number of I/Os 41I/Os
Operating Temperature -40°C~105°C TA
Packaging Tray
Series S08
Published 2013
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 48Terminations
ECCN Code 3A991.A.2
Terminal Finish Tin (Sn)
HTS Code 8542.31.00.01
Terminal Position QUAD
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Supply Voltage 3V
Terminal Pitch 0.5mm
Product Attribute Attribute Value
Time@Peak Reflow Temperature-Max (s) 40
JESD-30 Code S-PQFP-G48
Supply Voltage-Max (Vsup) 5.5V
Supply Voltage-Min (Vsup) 2.7V
Oscillator Type Internal
Speed 20MHz
RAM Size 4K x 8
Voltage - Supply (Vcc/Vdd) 2.7V~5.5V
uPs/uCs/Peripheral ICs Type MICROCONTROLLER
Peripherals LVD, POR, PWM, WDT
Clock Frequency 20MHz
Program Memory Type FLASH
Core Size 8-Bit
Program Memory Size 32KB 32K x 8
Connectivity I2C, LINbus, SPI, UART/USART
Bit Size 8
Has ADC YES
DMA Channels NO
PWM Channels YES
DAC Channels NO
EEPROM Size 256 x 8
Length 7mm
Width 7mm
RoHS Status ROHS3 Compliant
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MC9S08PA32AVLF Documents

Download datasheets and manufacturer documentation for   MC9S08PA32AVLF

Others include   "MC9S0"   parts

The following parts include  'MC9S0'

Part # Manufacturer Package Availability
MC9S08PA32AVLF NXP USA Inc. 48-LQFP 10086

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MC9S08PA32AVLF Comments

109 reviews

Bradley
2021-06-11 00:00:00

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2021-06-10 00:00:00

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2021-06-04 00:00:00

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2021-04-24 00:00:00

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2021-03-23 00:00:00

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2021-03-13 00:00:00

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2021-03-12 00:00:00

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2021-03-03 00:00:00

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