MCF5208CAB166 Tech Specifications

NXP  MCF5208CAB166 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Product Attribute Attribute Value
Category Embedded - Microcontrollers
Manufacturer NXP
Factory Lead Time 10 Weeks
Mounting Type Surface Mount
Package / Case 160-BQFP
Surface Mount YES
Number of I/Os 50I/Os
Operating Temperature -40°C~85°C TA
Packaging Tray
Series MCF520x
Published 2010
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 160Terminations
ECCN Code 3A991.A.2
Terminal Finish Matte Tin (Sn)
HTS Code 8542.31.00.01
Terminal Position QUAD
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Supply Voltage 1.5V
Terminal Pitch 0.65mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number MCF5208
JESD-30 Code S-PQFP-G160
Product Attribute Attribute Value
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.6V
Power Supplies 1.51.8/3.3V
Supply Voltage-Min (Vsup) 1.4V
Oscillator Type External
Speed 166.67MHz
RAM Size 16K x 8
Voltage - Supply (Vcc/Vdd) 1.4V~3.6V
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Core Processor Coldfire V2
Peripherals DMA, WDT
Clock Frequency 40MHz
Program Memory Type ROMless
Core Size 32-Bit
Connectivity EBI/EMI, Ethernet, I2C, SPI, UART/USART
Bit Size 32
Address Bus Width 24
Boundary Scan YES
Low Power Mode YES
External Data Bus Width 32
Format FIXED POINT
Integrated Cache YES
Length 28mm
Height Seated (Max) 3.85mm
Width 28mm
RoHS Status ROHS3 Compliant
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MCF5208CAB166 Documents

Download datasheets and manufacturer documentation for   MCF5208CAB166

Others include   "MCF52"   parts

The following parts include  'MCF52'

Part # Manufacturer Package Availability
MCF5208CAB166 NXP USA Inc. 160-BQFP

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MCF5208CAB166 Comments

109 reviews

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2024-03-06 00:00:00

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2024-03-04 15:56:56

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2024-02-21 00:00:00

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2024-01-24 00:00:00

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2023-11-28 00:00:00

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2023-11-22 00:00:00

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2023-11-21 00:00:00

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