XCVM1302-2MSENBVB1024 Tech Specifications

Xilinx  XCVM1302-2MSENBVB1024 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Product Attribute Attribute Value
Category Embedded - System On Chip (SoC)
Manufacturer Xilinx
Package / Case 5 mm x 3.2 mm
Supplier Device Package 1024-BGA (31x31)
Maximum Operating Temperature + 85 C
Supply Voltage-Max 3.3 V
Minimum Operating Temperature - 40 C
Factory Pack QuantityFactory Pack Quantity 1000
Supply Voltage-Min 3.3 V
Mounting Styles SMD/SMT
Manufacturer CTS
Brand CTS Electronic Components
RoHS Details
Number of I/Os 316I/Os
Package Tray
Mfr AMD Xilinx
Product Status Active
Series 636
Packaging Reel
Operating Temperature 0°C ~ 100°C (TJ)
Product Attribute Attribute Value
Subcategory Oscillators
Frequency 75 MHz
Frequency Stability 50 PPM
Termination Style SMD/SMT
Operating Supply Voltage 800 mV
Load Capacitance 15 pF
Speed 600MHz, 1.4GHz
RAM Size -
Core Processor Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Peripherals DDR, DMA, PCIe
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MPU, FPGA
Product Type Standard Oscillators
Output Format HCMOS, TTL
Primary Attributes Versal™ Prime FPGA, 70k Logic Cells
Flash Size -
Product Category Standard Clock Oscillators
Width 3.2 mm
Height 1.3 mm
Length 5 mm
View Similar

Others include   "XCVM1"   parts

The following parts include  'XCVM1'

Part # Manufacturer Package Availability
XCVM1302-2LLEVSVD1760 Xilinx 7 mm x 5 mm
XCVM1302-1LSIVSVD1760 Xilinx 1760-BFBGA, FCBGA
XCVM1302-1LLIVSVD1760 Xilinx 1760-BFBGA, FCBGA
XCVM1302-2LSEVSVF1369 Xilinx -
XCVM1302-2MLIVFVB1369 Xilinx -
XCVM1302-1LSEVFVB1369 Xilinx -
XCVM1302-2MSENBVB1024 Xilinx 5 mm x 3.2 mm
XCVM1302-2LLENBVB1024 Xilinx 1024-BFBGA
XCVM1302-2HSIVFVB1369 Xilinx -
XCVM1302-2MLEVSVD1760 Xilinx 1760-BFBGA, FCBGA

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XCVM1302-2MSENBVB1024 Comments

109 reviews

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2021-06-11 00:00:00

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