Xilinx Inc. XC7Z045-3FFG900E System On Chip 256KB BOTTOM 900Terminations
XC7Z045-3FFG900E
2773-492-XC7Z045-3FFG900E
900-BBGA, FCBGA
RoHS Compliant
Supply Voltage: 1V,RAM Size: 256KB,Series: Zynq®-7000,Packaging: Tray
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XC7Z045-3FFG900E Tech Specifications
Xilinx XC7Z045-3FFG900E technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Product Attribute | Attribute Value | |
|---|---|---|
| Category | Embedded - System On Chip (SoC) | |
| Manufacturer | Xilinx | |
| Factory Lead Time | 10 Weeks | |
| Contact Plating | Copper, Silver, Tin | |
| Package / Case | 900-BBGA, FCBGA | |
| Surface Mount | YES | |
| Memory Types | ROMless | |
| Number of I/Os | 130I/Os | |
| Operating Temperature | 0°C~100°C TJ | |
| Packaging | Tray | |
| Series | Zynq®-7000 | |
| Published | 2009 | |
| JESD-609 Code | e1 | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) | |
| Number of Terminations | 900Terminations | |
| ECCN Code | 3A991.D | |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
| HTS Code | 8542.39.00.01 | |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Peak Reflow Temperature (Cel) | 245 | |
| Supply Voltage | 1V | |
| Terminal Pitch | 1mm |
| Product Attribute | Attribute Value | |
|---|---|---|
| Frequency | 1GHz | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Base Part Number | XC7Z045 | |
| JESD-30 Code | S-PBGA-B900 | |
| Operating Supply Voltage | 1V | |
| Supply Voltage-Max (Vsup) | 1.05V | |
| Interface | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | |
| RAM Size | 256KB | |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | |
| Peripherals | DMA | |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |
| Architecture | MCU, FPGA | |
| Data Bus Width | 32b | |
| Core Architecture | ARM | |
| Boundary Scan | YES | |
| Speed Grade | -3 | |
| RAM (words) | 256000 | |
| Primary Attributes | Kintex™-7 FPGA, 350K Logic Cells | |
| Bus Compatibility | CAN; ETHERNET; I2C; SPI; UART; USB | |
| Length | 31mm | |
| Height Seated (Max) | 3.35mm | |
| Radiation Hardening | No | |
| RoHS Status | ROHS3 Compliant |
XC7Z045-3FFG900E Documents
Download datasheets and manufacturer documentation for XC7Z045-3FFG900E
Datasheets
XC7Z030,35,45,100 Datasheet Zynq-7000 User Guide Zynq-7000 All Programmable SoC Overview Zynq-7000 ErrataPCN Design/Specification
Mult Dev Material Chg 16/Dec/2019 Cross-Ship Lead-Free Notice 31/Oct/2016PCN Assembly/Origin
Substrate Supplier Addition 03/Nov/2014PCN Packaging
Mult Devices 26/Jun/2017Environmental Information
Xilinx RoHS3
Others include "XC7Z0" parts
The following parts include 'XC7Z0'
| Part # | Manufacturer | Package | Availability |
|---|---|---|---|
| XC7Z045-2FF676I | Xilinx Inc. | 676-BBGA, FCBGA | 628 |
| XC7Z045-2FF900I | Xilinx Inc. | 900-BBGA, FCBGA | 731 |
| XC7Z045-2FF900E | Xilinx Inc. | 900-BBGA, FCBGA | 264 |
| XC7Z045-2FFG900I | Xilinx Inc. | 900-BBGA, FCBGA | 733 |
| XC7Z045-2FFG900E | Xilinx Inc. | 900-BBGA, FCBGA | 912 |
| XC7Z045-1FBG676C | Xilinx Inc. | 676-BBGA, FCBGA | 612 |
| XC7Z045-1FFG900I | Xilinx Inc. | 900-BBGA, FCBGA | 991 |
| XC7Z045-1FFG676I | Xilinx Inc. | 676-BBGA, FCBGA | 616 |
| XC7Z045-1FFG900C | Xilinx Inc. | 900-BBGA, FCBGA | 1573 |
| XC7Z045-2FBG676E | Xilinx Inc. | 676-BBGA, FCBGA | 653 |
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| Part # | Manufacturer | Description | Package | RoHS | |
|---|---|---|---|---|---|
 | XC7Z045-3FFG900E | Xilinx Inc. | IC SOC CORTEX-A9 KINTEX7 900FBGA | 900-BBGA, FCBGA | |
 | MCIMX6Q5EYM10AC | NXP USA Inc. | I.mx 6 Series 32-Bit Mpu, Quad Arm Cortex-A9 Core, 1Ghz, Fcbga 624 Rohs Compliant: Yes | 624-LFBGA, FCBGA | |
 | TMS320C6455BCTZ | Texas Instruments | DSP Fixed-Point 32bit 1GHz 8000MIPS 697-Pin FCBGA | 697-BFBGA, FCBGA | |
| MCIMX6D5EYM10AD | NXP USA Inc. | MPU i.MX RISC 32-Bit 1000MHz 1.8V/2.8V/3.3V 624-Pin FCPBGA Tray | 624-LFBGA, FCBGA | |
 | MCIMX6D6AVT10AD | NXP USA Inc. | IC MPU I.MX6D 1.0GHZ 624FCBGA | 624-FBGA, FCBGA |
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XC7Z045-3FFG900E Comments
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