XCZU3CG-1SFVA625I Tech Specifications

Xilinx  XCZU3CG-1SFVA625I technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Product Attribute Attribute Value
Category Embedded - System On Chip (SoC)
Manufacturer Xilinx
Factory Lead Time 11 Weeks
Package / Case 625-BFBGA, FCBGA
Number of I/Os 180I/Os
Operating Temperature -40°C~100°C TJ
Packaging Bulk
Series Zynq® UltraScale+™ MPSoC CG
Published 2016
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Product Attribute Attribute Value
HTS Code 8542.31.00.01
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Speed 500MHz, 1.2GHz
RAM Size 256KB
Core Processor Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
RoHS Status ROHS3 Compliant
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XCZU3CG-1SFVA625I Documents

Download datasheets and manufacturer documentation for   XCZU3CG-1SFVA625I

Others include   "XCZU3"   parts

The following parts include  'XCZU3'

Part # Manufacturer Package Availability
XCZU3CG-1SBVA484E Xilinx Inc. 484-BFBGA, FCBGA 380
XCZU3CG-1SFVA625E Xilinx Inc. 625-BFBGA, FCBGA 2000
XCZU3CG-1SFVC784E Xilinx Inc. 784-BFBGA, FCBGA 2279
XCZU3CG-2SFVC784I Xilinx Inc. 784-BFBGA, FCBGA 3000
XCZU3CG-2SBVA484I Xilinx Inc. 484-BFBGA, FCBGA 1500
XCZU3CG-2SFVA625I Xilinx Inc. 625-BFBGA, FCBGA 680
XCZU3CG-1SFVA625I Xilinx Inc. 625-BFBGA, FCBGA 300
XCZU3CG-2SFVC784E Xilinx Inc. 784-BFBGA, FCBGA 658
XCZU3CG-1UBVA530I Xilinx FBGA-530
XCZU3CG-1UBVA530E Xilinx FBGA-530

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XCZU3CG-1SFVA625I Comments

109 reviews

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2021-06-11 00:00:00

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