Texas Instruments announced a new solid-state relays portfolio, featuring automotive-qualified isolated drivers and switches.
Texas Instruments has recently introduced a new portfolio of solid-state relays, including automotive-qualified isolated drivers and switches, that deliver industry-leading reliability to help make EVs safer. The innovative isolated solid-state relays also offer the smallest solution size while lowering powertrain and 800-V battery-management system BOM costs.
In comparison to traditional electromechanical relays, the TPSI3050-Q1 isolated switch driver with an integrated 10-V gate supply and the TPSI2140-Q1 1,400-V, 50-mA isolated switch both integrate power and signal isolation over a single barrier utilizing a new technique that increases reliability while dramatically decreasing solution size and cost.
The TPSI3050-Q1, which provides reinforced isolation up to 5 kVRMS, also has a 10 times longer working lifetime than electromechanical relays, which degrade over time. Furthermore, the TPSI2140-Q1 provides basic isolation up to 3.75 kVRMS, allowing it to achieve a time-dependent dielectric breakdown reliability that is more than four times that of solid-state photorelays.
“High-voltage systems are becoming more common, especially as the number of electric vehicles (EVs) grows. At TI, we’re focused on helping system designers solve complex isolation challenges like ensuring reliable and safe vehicle operation as the industry transitions to 800-V batteries while also reducing solution size and cost “Texas Instruments’ vice president and general manager of Power Switches, Interface, and Lighting, Troy Coleman, said. “Our innovative solid-state relays enable engineers to minimize the size, cost, and complexity of high-voltage power supplies while ensuring the safety of next-generation automotive and industrial systems by combining more functionality inside our isolation technology” he added.
TI’s solid-state relays combine power and signal transfer in a single chip and eliminate at least three components from their designs, resulting in a 50% reduction in BOM costs and a considerable reduction in solution size.
