FDC6304P Tech Specifications

ON Semiconductor  FDC6304P technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Product Attribute Attribute Value
Category Transistors - FETs, MOSFETs - Arrays
Manufacturer ON Semiconductor
Lifecycle Status ACTIVE (Last Updated: 1 day ago)
Factory Lead Time 10 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case SOT-23-6 Thin, TSOT-23-6
Number of Pins 6Pins
Weight 36mg
Transistor Element Material SILICON
Current - Continuous Drain (Id) @ 25℃ 460mA
Number of Elements 2 Elements
Turn Off Delay Time 55 ns
Operating Temperature -55°C~150°C TJ
Packaging Tape & Reel (TR)
JESD-609 Code e3
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 6Terminations
ECCN Code EAR99
Resistance 1.1Ohm
Terminal Finish Tin (Sn)
Voltage - Rated DC -25V
Max Power Dissipation 700mW
Product Attribute Attribute Value
Terminal Form GULL WING
Current Rating -460mA
Element Configuration Dual
Operating Mode ENHANCEMENT MODE
Power Dissipation 900mW
Turn On Delay Time 7 ns
FET Type 2 P-Channel (Dual)
Transistor Application SWITCHING
Rds On (Max) @ Id, Vgs 1.1 Ω @ 500mA, 4.5V
Vgs(th) (Max) @ Id 1.5V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds 62pF @ 10V
Gate Charge (Qg) (Max) @ Vgs 1.5nC @ 4.5V
Rise Time 8ns
Drain to Source Voltage (Vdss) 25V
Fall Time (Typ) 8 ns
Continuous Drain Current (ID) -460mA
Threshold Voltage -860mV
Gate to Source Voltage (Vgs) 8V
Drain to Source Breakdown Voltage -25V
FET Technology METAL-OXIDE SEMICONDUCTOR
FET Feature Logic Level Gate
REACH SVHC No SVHC
Radiation Hardening No
RoHS Status ROHS3 Compliant
Lead Free Lead Free
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FDC6304P Documents

Download datasheets and manufacturer documentation for   FDC6304P

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FDC6304P Comments

109 reviews

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2021-06-11 00:00:00

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2021-06-10 00:00:00

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