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Introduction to Nexperia Automotive-Grade ICs
Electronics in the automotive industry require accuracy, durability and complete reliability. All systems, including the engine control and modern driver assist, are based on parts that have to endure both high temperature and electrical interference, as well as extended durability of operation.
ASIC vs FPGA Comparison: Performance, Cost, and Design Differences Explained
This article compares Application-Specific Integrated Circuits (ASICs) and Field-Programmable Gate Arrays (FPGAs), two technologies used for creating custom digital circuits.
The Rise of Automotive-Grade SiC/GaN Power Devices in Electric Vehicles
The automotive fast recovery Silicon Carbide (SiC) and Gallium Nitride (GaN) power devices emerge as game-changing technologies.
How to Safely Discharge an AC Capacitor
AC capacitor discharge refers to the process in which a capacitor releases its stored electrical energy in an alternating current (AC) circuit.
Signs of a Bad Camshaft Position Sensor and How to Test it?
A car has a variety of electrical components, one of which is called a camshaft position sensor (CMP). This section will discuss this component, the signs that indicate a problematic camshaft position sensor, and the procedures for doing so.
Symptoms of a Bad Speed Sensor and How to Test It?
Speed sensors are utilized to measure the speed at which devices are spinning. Many vehicles, including automobiles, aerospace vehicles, off-highway and construction equipment, railway vehicles, and military vehicles, require speed sensors.
Current Divider: definition, applications & formula
A current divider is an electrical circuit configuration used to split or divide an input current into multiple branches or paths.
74LS04 Hex Inverter Datasheet(PDF) and Pinout
This article will explain some detailed information about 74LS04 Hex Inverter, including its datasheet, pinout, features and specifications.
C1815 Transistor: Pinout, Features & Specifications
This article gives a comprehensive introduction to the key information of the C1815 transistor
Guide to IC 7408 Logic Gate Chip: Specifications, Applications, and Pinout
The 7408 IC, a crucial component in electronics, features?four logic gates, each with two inputs.
Hot Tag design
Innoscience Starts European R&D Centre in GaN Valley of Beligium
Innoscience, a manufacturer of GaN devices started a new R&D centre in Leuven, Belgium and Dr. Jan onsk joined as Vice President of R&D
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01/07/2022
Physical Analysis of the Termination Region on Switching Loss
SiC MOSFETs come with remarkable properties and a unipolar conduction mechanism, which leads to a reduction in their size and improved switching performance.
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25/05/2022
The Route to Wireless Charging of Electric Vehicles
Wireless charging offers a number of benefits to both electric vehicle owners and infrastructure providers in terms of simplicity, reliability, and ease of use.
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11/05/2022
Minimizing Second-Order Ripples and DC Capacitance for EV Chargers
EV technology is the future of the automobile industry that continuously sees rapid advancements in battery and fast charger technology.
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28/04/2022
Dynamic Circuit Model of a SiC VJFET
SiC semiconductors perform considerably well on various parameters like high temperatures, frequency, voltage, and several others.
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28/04/2022
Next Generation of GaN for Electrification
Gallium nitride is a key component of future energy-efficient electric vehicles and 5G networks. Hexagem, a Lund University–based startup, is developing a new solution at the Swedish research institute Rise testbed ProNano. This solution should contribute to greater electrification and a sustainable future.
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28/04/2022
A Brave New Circular World
I don’t usually discuss regulatory requirements in this column, but today I am. Environmental regulatory requirements often must be addressed in the Product Requirements Documen and,
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28/04/2022
Flexible PCBs Enhance EV Design
Trackwise initially developed the capability to manufacture length-unlimited, flexible circuits because of a requirement from Rolls Royce.
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09/06/2021
The network-on-chip interconnect is the SoC
“The network is the computer,” coined by John Gage of Sun Microsystems back in 1984, proved incredibly insightful. This idea is re-emerging, this time within the SoC realm.
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05/06/2021
Why network-on-chip has displaced crossbar switches at scale
When the number of elements that need to communicate in a chip is small, a simple crossbar approach to the interconnect function is a possible choice.
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26/05/2021
Processing Solutions for High-Density PCBs
Designers must consider processing temperatures, producibility, and solder joint integrity of every component as well as higher I/O connectors. This article looks at ways to enable smaller component footprints for high-density PCBs.
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25/05/2021
A Novel Method for Measuring Pressure Exchanges within Battery Housing for Lifecycle Testing
Many of those that are familiar with the construction of a prismatic lithium-ion battery will say that it breathes. Charging and discharging causes temperature changes, electrochemistry, and mechanics of the internal components that, in turn, change the internal pressures. As manufacturers try to create a product that is efficient, lightweight, and safe, it is of paramount importance that designers intimately understand these characteristics.
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25/05/2021